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A team of researchers at the Fraunhofer Institute for Optoelectronics, Systems Technology and Image Development and Karlsruhe Institute of Technology are using single-photon avalanche diode (SPAD) arrays to achieve three-dimensional (3D) quantum ghost imaging.The new method, called "asynchronous detection," produces the lowest photon dose of any measurement and can be used to image light-sensitive...
Recently, Fabrinet released its financial report for the three months ended December 27, 2024, showing that its sales and revenue exceeded expectations. During the reporting period, the company achieved sales of $834 million, a year-on-year increase of 17%. Net income increased by 25% during the same period, reaching $86.6 million.Although the growth in performance is still dominated by the optica...
Recently, Yawei Group signed a complete set of sheet metal laser processing equipment with Hubei Zhonggang Metal Xianning Second Production Base, adding bricks and tiles to the takeoff of Zhonggang Metal Business. After full production, the annual production of various aluminum metal plates will exceed 6 million square meters, and Zhonggang Metal will usher in another leap forward development!Zhon...
近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备 该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。 该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。 近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...
Recently, Sivers Semiconductors, a leading supplier of integrated chips and photonics modules for communication and sensing solutions, announced a significant strategic initiative:It will divest its subsidiary Sivers Photonics Ltd, which has signed a non binding letter of intent (LOI) with byNordic Acquisition Corporation and plans to achieve independent listing through a merger. This move aims ...