- No Data
English
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
The rapidly developing IoTech enterprise headquartered in Israel will showcase at LOPEC 2024 how its disruptive digital manufacturing continuous laser assisted deposition technology shapes the future of microelectronics and additive manufacturing.Herv é Javice, co-founder and CEO of ioTech, commented, "We are delighted to be attending the LOPEC exhibition for the first time and showcasing ...
Recently, DIT, a well-known semiconductor and display equipment manufacturer in South Korea, announced that the company has signed an agreement worth 20.52 billion Korean won to supply wafer processing equipment to SK Hynix. After the announcement, DIT's stock price rose for five consecutive days, entering the 16000 Korean won range. Then on the 22nd, it rose 2580 Korean won from the previous day'...
Recently, a team from the National Key Laboratory of Ultra strong Laser Science and Technology at the Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, collaborated with the Arctic University of Norway (UiT) to make progress in the efficient cracking of high-density polyethylene (HDPE) using strong laser molecular bond breaking technology. The research results were publ...
Recently, Laser Photonics Corporation (LPC), a laser cleaning equipment developer listed on NASDAQ in the United States, announced that the company has signed a final agreement to acquire Control Micro Systems, Inc. (CMS) through an Asset Purchase Agreement (APA), but the financial details of the transaction have not yet been disclosed.At present, LPC's market value has shrunk by 70%, and it is de...
Recently, Halo Industries, an innovative technology company based in California, announced that it has successfully raised $80 million in Series B venture capital, marking a significant breakthrough in its use of laser technology to revolutionize the production of silicon carbide (SiC) semiconductor wafer substrates.This financing is led by the US Innovation Technology Fund (USIT) and involves hea...