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By using a new type of laser, the processing speed of wafers can be 10 to 20 times faster than before. This is the result of a research project at the Fraunhofer Institute for Solar Systems in Germany.Researchers have developed a prototype that can use ultraviolet waves to carve the most intricate structures on silicon wafers. The new system concept enables solar cell manufacturers to perform lase...
Chip giant Intel announced that it has completed the assembly work of the world's first commercial high numerical aperture (NA) extreme ultraviolet lithography (EUV) scanner. This device greatly improves the resolution and feature scaling of next-generation chips by changing the optical design used to project printed images onto silicon wafers.This lithography equipment weighing 150 tons has been ...
Researchers have developed a 60 milliwatt solid-state DUV laser with a wavelength of 193 nanometers using LBO crystals, setting a new benchmark for efficiency values.In the fields of science and technology, utilizing coherent light sources in deep ultraviolet (DUV) regions is of great significance for various applications such as lithography, defect detection, metrology, and spectroscopy. Traditio...
Children (and adults) like to collect toys, but what if they can make them themselves? This is exactly the focus of the Toybox 3D printer luxury bundle. This 3D printer for children's toys incorporates innovative technology into simplified products, making it very suitable for young people. Do you want to have your own? The cost of this 3D toy printer has been reduced to $348.99.Generally speaking...
According to South Korean media etnews, Samsung Electronics and SK Hynix have started the process technology conversion of high bandwidth memory (HBM) wafers, with the introduction of new technologies to prevent wafer warping as the core, which is considered to be aimed at the next generation HBM. It is expected that with the process transformation, the material and equipment supply chain will als...