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In the last century, the improvement of mechanical properties of structural metals was mainly achieved through the creation of increasingly complex chemical compositions. The complexity of this ingredient increases costs, creates supply fragility, and makes recycling more complex.As a relatively new metal processing technology, metal 3D printing provides the possibility to re-examine and simplify ...
Recently, EO Technologies, a well-known semiconductor laser processing equipment manufacturer in South Korea, is emerging in the glass substrate processing market.It is understood that EO Technologies is entering the glass substrate TGV market based on its UV laser drilling equipment originally used in PCB substrate technology. TGV technology is the core process for drilling holes inside glass sub...
Recently, Siemens Energy's Materials Solutions division (hereinafter referred to as Siemens) officially signed a cooperation agreement with Rolls Royce, a well-known enterprise in the field of aviation engines in the UK, agreeing that Siemens will develop and supply mass-produced additive manufacturing components for Rolls Royce's civil aerospace business.Rolls Royce and 3D Printing TechnologyRoll...
近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备 该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。 该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。 近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...
Recently, Keyence announced that it has delivered the MD-U series of 3-axis controlled UV laser marking machines to its UK customers. This product technology utilizes ultraviolet lasers with high absorption rates to perform cold labeling on various materials - a process that can be carried out under minimum thermal stress.UV laser is generated by passing a standard wavelength laser (1064nm) throug...